We provide one of the largest, most comprehensive lines of sputtering target materials. All popular geometries (and sizes) including rings, S-Guns and circular, rectangular and triangular and planar targets are available.
Most sputtering target materials can be fabricated into a wide range of shapes and sizes. There are some technical limitations to the maximum size for a given single piece construction. In such cases, a multi-segmented target can be produced with the individual segments joined together by butt or bevelled joints.
Please contact us if your required sputtering target material and/ or purity are not listed.
The specific manufacturing process employed in the production of sputtering targets is largely determined by the unique properties of the target material itself, as well as the intended application of the sputtering target. Various techniques such as classical and vacuum hot-pressing, cold-pressing, sintering, and vacuum melting and casting are routinely utilized to create a diverse range of sputtering sources. Each of these methods has its own advantages and is selected based on the desired characteristics of the final product.
To ensure that we meet the highest quality standards in our sputtering targets, we employ state-of-the-art powder mixing and/or alloying techniques. This is often achieved through sintering and/or melting of raw materials, followed by meticulous grinding processes. Each production lot of material undergoes a series of rigorous analytical processes to verify its quality and consistency. As a testament to our commitment to quality, a certificate of analysis is provided with every shipment, giving our customers confidence in the materials they receive.
One of the most critical factors influencing a sputtering target’s performance during the deposition process is its grain structure. Finer grain sizes are known to significantly reduce variations in film uniformity and deposition rates, which are essential for achieving high-quality coatings. Additionally, a random or equiaxed grain orientation contributes to improved film uniformity, further enhancing the overall performance of the sputtering target. By properly controlling the grain structure of the target, we can enable higher yielding and more consistent deposition processes, which are crucial for various applications in industries such as electronics, optics, and materials science.
We take pride in utilizing a variety of advanced manufacturing methods to produce sputtering targets that feature a very fine grain structure. Our extensive portfolio of sputtering target materials allows us to cater to a wide range of specifications, and we can produce targets in nearly any shape or size to meet the specific needs of our clients.
If you find that your required sputtering target material and/or purity is not listed in our offerings, please do not hesitate to contact us. We are here to assist you in finding the right solution for your sputtering needs.
Sputtering Targets are available from a wide variety of compositions in various purity levels, allowing our customers to match targets to their specific requirements.
Sputter deposition has the advantages of reproducibility and simpler process automation - compared to E-Beam or thermal evaporation. Multiple variations in the sputter technique have been developed. Optical films can be deposited from a metal sputtertargets by oxidizing/ nitriding sputtered metal ions to deposit an oxide or nitride film layer of the desired composition.
DC magnetron sputtering is the technique used for metal targets that are electrically conducting. Oxide (insulating) sputtertargets can be sputtered by RF sputtering, but the rate is lower. Practically any material alloy, mixture, pure metal, oxide, nitride, boride, carbide can be supplied as a sputtertarget.
Please contact us if your required sputtering target material and/ or purity are not listed.
Depending on the particular system and material your sputtering target may require bonding. Backing plates can be fabricated to match virtually any target composition and configuration. We will perform bonding/de-bonding of sputtertargets ordered from us or of sputtering targets and backing plates provided by the customer. We also provide silver-filled epoxy cement containing the optimum ratio of silver powder to epoxy resin for maximum thermal and electrical conductivity and mechanical strength.
Further information on our bonding services can be found here.
Magnetron sputtering is an advanced and highly sophisticated deposition technology that plays a crucial role in various industrial applications. This innovative process utilizes a gaseous plasma, which is both generated and confined within a specifically designated space that houses the material intended for deposition. This material is commonly referred to as the sputter target or sputtering target. During the magnetron sputtering process, the surface of the sputtering target is gradually eroded by high-energy ions that are present within the plasma. This erosion is not just a byproduct; it is a critical aspect of the technology, as it facilitates the transfer of material from the sputtering target to the substrate, allowing for the creation of thin films with precise characteristics.
One of the standout features of magnetron sputtering is its exceptional versatility as a method for thin film deposition. Unlike other deposition techniques, which often impose strict limitations regarding the types of materials that can be utilized as sputtering targets, magnetron sputtering offers a much broader range of possibilities. The source material can be nearly anything, as this method does not necessitate that the material be melted or evaporated in order to be effectively deposited. This inherent flexibility opens up a world of options for researchers, engineers, and manufacturers alike, enabling them to explore a diverse array of materials and compositions for their specific applications.
Moreover, the films that are deposited through the sputtering process tend to have a composition that closely mirrors that of the source material. This ensures high fidelity in the final product, which is essential for applications that require precise material properties. Additionally, these sputter-deposited films exhibit superior adhesion to the substrate compared to films that are created through traditional evaporation methods. This characteristic is particularly important in industries where durability and performance are paramount, making magnetron sputtering an ideal choice for a variety of applications across multiple sectors.
In particular, magnetron sputtering has found widespread use in industries such as electronics, optics, and coatings. In the electronics sector, it is employed to create thin films for semiconductors, capacitors, and other critical components. In optics, magnetron sputtering is used to produce high-quality coatings for lenses and mirrors, enhancing their performance and durability. Furthermore, in the coatings industry, this technology is utilized to apply protective and decorative layers to a wide range of substrates, improving their resistance to wear, corrosion, and other environmental factors.
In conclusion, magnetron sputtering stands out as a highly effective and versatile deposition technology that offers numerous advantages over traditional methods. Its ability to accommodate a wide variety of materials, combined with the high fidelity of the deposited films and their superior adhesion properties, makes it an invaluable tool in modern manufacturing and research. As industries continue to evolve and demand more advanced materials, the importance of magnetron sputtering is only expected to grow.
Ion Beam Sputtering (IBS) is a highly advanced and sophisticated process that is characterized by its remarkable ability to produce extremely precise and uniform layers of material. This innovative technology employs a focused ion beam to generate high-density coatings that not only exhibit excellent adhesion but also possess clearly defined morphology. The precision and control offered by IBS are unparalleled, allowing for meticulous adjustments to be made regarding coating thickness and material properties. This level of control makes IBS particularly valuable for a wide range of high-end applications across various industries.
One of the most significant areas where IBS coatings play a crucial role is in the field of optics. The outstanding control over coating thickness and optical properties provided by this technology is essential in the manufacturing of laser mirrors and optical filters. In these applications, the highest levels of precision are required to ensure optimal component performance and longevity. The ability to manipulate the layers with such high accuracy not only enhances the functionality of optical devices but also opens up new avenues for innovation in the design and manufacture of advanced optical technologies.
Furthermore, we take pride in offering an extensive portfolio of sputtering targets that are specifically tailored to meet the unique requirements of your IBS process. Our selection includes a variety of high-quality targets such as hafnium targets, tantalum targets, niobium targets, and silicon targets. Additionally, we provide HfO2 targets, which are essential for certain applications, along with the necessary bonding solutions to ensure seamless integration into your processes. By choosing our products, you can be confident that you are utilizing the best materials available to achieve superior results in your ion beam sputtering endeavors. Whether you are working on cutting-edge optical devices or other high-performance applications, our offerings are designed to support your success and drive innovation in your projects.
